JPH0464866B2 - - Google Patents

Info

Publication number
JPH0464866B2
JPH0464866B2 JP59045113A JP4511384A JPH0464866B2 JP H0464866 B2 JPH0464866 B2 JP H0464866B2 JP 59045113 A JP59045113 A JP 59045113A JP 4511384 A JP4511384 A JP 4511384A JP H0464866 B2 JPH0464866 B2 JP H0464866B2
Authority
JP
Japan
Prior art keywords
film
power supply
electroless plating
substrate
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59045113A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60189464A (ja
Inventor
Hideo Sawai
Takashi Kanamori
Tamahiko Nishiki
Kenichi Araki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP59045113A priority Critical patent/JPS60189464A/ja
Publication of JPS60189464A publication Critical patent/JPS60189464A/ja
Publication of JPH0464866B2 publication Critical patent/JPH0464866B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electronic Switches (AREA)
JP59045113A 1984-03-09 1984-03-09 サ−マルヘツドの製造方法 Granted JPS60189464A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59045113A JPS60189464A (ja) 1984-03-09 1984-03-09 サ−マルヘツドの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59045113A JPS60189464A (ja) 1984-03-09 1984-03-09 サ−マルヘツドの製造方法

Publications (2)

Publication Number Publication Date
JPS60189464A JPS60189464A (ja) 1985-09-26
JPH0464866B2 true JPH0464866B2 (en]) 1992-10-16

Family

ID=12710204

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59045113A Granted JPS60189464A (ja) 1984-03-09 1984-03-09 サ−マルヘツドの製造方法

Country Status (1)

Country Link
JP (1) JPS60189464A (en])

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5726324Y2 (en]) * 1976-06-14 1982-06-08
JPS54128746A (en) * 1978-03-29 1979-10-05 Matsushita Electric Ind Co Ltd Production of thin film type thermal head

Also Published As

Publication number Publication date
JPS60189464A (ja) 1985-09-26

Similar Documents

Publication Publication Date Title
US5111179A (en) Chip form of surface mounted electrical resistance and its manufacturing method
JPS60113993A (ja) 多層回路基板の製造方法
JPS61188902A (ja) チツプ抵抗器及びその製造方法
JPS61194794A (ja) 混成集積回路基板の製造方法
JPH0464866B2 (en])
JPH09307216A (ja) 配線基板の製造方法及び配線基板
JPS61185995A (ja) 抵抗体付き回路基板の製法
JPH0682908B2 (ja) 抵抗体付セラミック回路板の製造方法
JPH02915Y2 (en])
JPS6227675B2 (en])
JP3129912B2 (ja) サーマルヘッドの製造方法
JPS62257702A (ja) 配線基板の製造方法
TW201021641A (en) Method for manufacturing embedded film resistor of printed circuit board
JPS6059765A (ja) 混成集積回路基板の製造方法
JPS6285496A (ja) 回路基板の製造方法
JPH0513510A (ja) Ｔａｂ用テープキヤリア
JPS6142192A (ja) セラミツク基板の製造方法
JPS62287695A (ja) メタルコア銅張りホ−ロ−基板の製造方法
JPH029190A (ja) 抵抗体付セラミック回路板の製造方法
JPH0682909B2 (ja) 抵抗体付セラミック回路板の製造方法
JPS6259480B2 (en])
JPH04357895A (ja) セラミック配線板の製造法
JPH0465024A (ja) ジャンパーチップ
JPS59202602A (ja) 金属薄膜抵抗体及びその製造方法
JPS6356992A (ja) プリント配線板及びその製造方法